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ELECĀ 5504 [0.5 credit] (ELG 6354) Analysis of High-Speed Electronic Packages and Interconnects

Introduction to modeling, simulation and optimization of high-speed VLSI packages; models for packages, interconnects and ground/power planes; lumped, distributed and EM models for interconnects; delay, crosstalk and switching noise; moment matching techniques; concurrent thermal/electrical analysis of IC packages and boards.